- Products
- Micro Assembly
FINEPLACER® femtoAutomated Sub-micron Die BonderUp to 0.5 micron accuracy
Production platform
FINEPLACER® matrix maSemi-automatic Die BonderUp to 3 micron accuracy
300 mm wafer bonder
FINEPLACER® lambdaFlexible Sub-micron Die BonderUp to 0.5 micron accuracy
Application versatility
FINEPLACER® pico maMulti-purpose Die BonderUp to 5 micron accuracy
Application versatility
FINEPLACER® pico amaAutomated Flip Chip BonderUp to 5 micron accuracy
High flexibility
- Advanced Rework
FINEPLACER® coreEnergy-efficient, Cost-effective ReworkProven technology where process reproducibility is critical
FINEPLACER® coreplusEnergy-efficient, Cost-effective ReworkProven technology where process reproducibility is critical
FINEPLACER® jumbo rsLarge Area Rework StationBoard sizes to 750 mm x 500 mm
FINEPLACER® pico rsHigh Density Rework StationRework in high density environments
FINEPLACER® micro rsHot Air SMD Rework StationLarge field of view
Board size to 460 mm x 310 mm
FINEPLACER® micro hvrHigh Volume Rework StationBoard sizes to 350 mm x 260 mm
FINEPLACER® matrix rsFuture in Advanced ReworkSmallest pitch, most complex integration, largest array device capable
Hotbeam UnderheaterThe compact and flexible underheater Hotbeam is the ideal supplement to a FINEPLACER® rework station.
MiniOven 04A compact and versatile IR reflow oven suitable for a wide range of SMD components.
Clever DispenseManual dispensing with high quality results
- Micro Assembly
- Micro Assembly
- Applications
Anisotropic Conductive Film for Flip Chip ApplicationsAnisotropic conductive film is a lead-free adhesive system that has been used for more than 30 years...
Chip-on-Glass (CoG)Chip-On-Glass is a flip chip technology for direct connection assembly of ICs on glass substrates by using adhesive materials.
Edge-Bonded Stacked DieStacked die, perhaps the simplest and most used 3D technology, piles up and connects a stack of die...
Flip Chip Interconnection for Detector ArraysFlip chip interconnection is the smallest interconnection method, wasting the least possible area...
Laser Bar BondingSemiconductor lasers are versatile, light-emitting optical units which can be found in a variety of industrial applications. 
Optoelectronic Flip Chip AssemblyA growing requirement to include optical devices in microelectronic assemblies presents new challenges to the manufacturer.
Optical Module AssemblyOptical packages are assemblies comprising optical and electronic components.
Putting Photons on the ChipSmaller die and higher speed required for high-performance microprocessors will require unconventional interconnection techniques...
RFID AssemblyRFID (Radio Frequency Identification) tags are used as an alternative to bar codes for inventory control and theft protection. 
Flip Chip BondingThe thermosonic bonding advantages and the disadvantages of lead-free solder are stimulating the growth of this low temperature gold-to-gold connection.
Thin Gold-to-Gold Bonding for Flip ChipSolder has been the mainstream flip chip assembly method since the 1990s...
VCSEL & Photo DiodeThe assembly and packaging of optoelectronic devices is...
- Technologies
AuSn SolderingGold/Tin (Au/Sn) make for hard solder alloys especially used to bond demanding microelectronic and optoelectronic devices.
Ultrasonic / Thermosonic BondingUltrasonic / thermosonic bonding is a connection process that does not need bonding wires and is mainly used for Flip Chips.
ThermocompressionThermocompression bonding is a connection process that does not need bonding wires. It is mainly used in case of Flip Chip bonding.
Adhesive TechnologiesAdhesive materials can be applied between two join partners in various ways.
- Products
- FINEPLACER® femtoAutomated Sub-micron Die BonderUp to 0.5 micron accuracy
Production platform - FINEPLACER® matrix maSemi-automatic Die BonderUp to 3 micron accuracy
300 mm wafer bonder - FINEPLACER® lambdaFlexible Sub-micron Die BonderUp to 0.5 micron accuracy
Application versatility - FINEPLACER® pico maMulti-purpose Die BonderUp to 5 micron accuracy
Application versatility - FINEPLACER® pico amaAutomated Flip Chip BonderUp to 5 micron accuracy
High flexibility
- Videos
Chip on Wafer AssemblyHow to video: Chip on Wafer Assembly
AuSn Laser Bar BondingHow to video: AuSn Laser Bar Bonding
Thermosonic BondingHow to video: Au-Au Thermosonic Bonding
Automatic AssemblyHow to video: Automatic Assembly
Ultrasonic BondingHow to video: Ultrasonic Bonding
Laser Bar BondingHow to video: Laser Bar Bonding
R&D BonderFINEPLACER® lambda - R&D Bonder
- Applications
- Advanced Rework
- Applications
Rework of BGA / CSPBGA Rework has become synonymous for SMT Rework in general. Learn more...
Rework of Shielded SMDAs PCB real-estate continues to be in high demand, the RF shield design will remain a challenge to rework. 
QFN ReworkFlat packages such as QFN provide many benefits but make much higher demands compared to the handling of standard SMD components.
01005 Rework01005 small passive components are becoming more and more important these days (integration, miniaturisation, etc.).
Package on Package (PoP)Package on Package (PoP) is an IC-packaging technology with vertical combined logic and memory components where ...
Underfill ReworkUnderfilled chips are used in consumer electronics, automotive industry or many miniaturized product.
Chip-on-Flex ReworkFlexible substrates are used in 3D connection and mechatronic concepts for...
Flip Chip ReworkFlip Chip rework is becoming more important in order to save costs by recycling valuable materials.
- Processes
Single Ball ReballingFinetech offers reliable reballing solutions for single ball replacement down to 200 µm dia.
BGA ReballingBGA reballing means placement of new solder balls on a used BGA
Residual Solder RemovalThis section deals with the process related issue of eliminating residual solder once a component has been removed from a PCB. 
Apply Solder PasteFinetech offers various equipment solutions to integrate the suitable solder application method into the rework cycle.
- Products
- FINEPLACER® coreEnergy-efficient, Cost-effective ReworkProven technology where process reproducibility is critical
- FINEPLACER® coreplusEnergy-efficient, Cost-effective ReworkProven technology where process reproducibility is critical
- FINEPLACER® jumbo rsLarge Area Rework StationBoard sizes to 750 mm x 500 mm
- FINEPLACER® pico rsHigh Density Rework StationRework in high density environments
- FINEPLACER® micro rsHot Air SMD Rework StationLarge field of view
Board size to 460 mm x 310 mm - FINEPLACER® micro hvrHigh Volume Rework StationBoard sizes to 350 mm x 260 mm
- FINEPLACER® matrix rsFuture in Advanced ReworkSmallest pitch, most complex integration, largest array device capable
- Hotbeam UnderheaterThe compact and flexible underheater Hotbeam is the ideal supplement to a FINEPLACER® rework station.
- MiniOven 04A compact and versatile IR reflow oven suitable for a wide range of SMD components.
- Clever DispenseManual dispensing with high quality results
- Videos
- Applications
- Services
- Overview
Service OffersMore about our service world wide Service Team and philosophy.
Application ServiceSave time and money with approved rework solder profiles.
Service RequestGet in touch with our Service and Support team.
TrainingLearn more about our INHOUSE training offers.
WarrantyMaximum equipment protection and savings with our advanced warranty program.
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