ACF Module
The ACF (Anisotropic Conductive Film) Module consists of the ACF tool and a separate control box. It enables 'pre-bonding' of transparent und non transparent ACF-adhesive film.The module allows unobstructed view of chip and substrate during alignment to guarantee highest placement accuracy.
Highlights*
- Used for ACF pre-bonding
- Integrated heater
- Teflon coated tool tip for various chip sizes
- Suitable for using opaque ACF
* depending on configuration
Available for FINEPLACER® pico ma
ACF Module FG1
ACF Module
| Pre-bonding Power (max): | 80 W |
| Temperature (max): | 120° C |
| Temperature ramp (max): | 3 K/s |
| Film size (min): | 2 mm x 2 mm |
| Film size area A (max): | 16 mm x 14 mm |
| Film size area B (max): | 3.5 mm x 28 mm |
| Sales code: | FG1 |
*Technical information are standard values (other values on request). Specification given are subject to change without notice and may not be used as a basis for a binding offer or quotation.