Spinner
 

Page Tools

Sales Contact

  • Robert Avila
    Finetech - USA/West
    Phone:
    +1 480 893 1630
    Fax:
    +1 480 893 1632
    Micro AssemblyPartner ReworkPartner
    get in contact

Looking for?

FINEPLACER® pico ma

Multi-purpose Die Bonder

The FINEPLACER® pico ma, a multi-purpose bonder, offers high placement accuracy (5 micron), allowing for bonding of the smallest die with a pitch of down to 50 µm.

This versatile platform is used in a wide field of micro assembly applications – such as flip chip and die bonding.

Designed for prototyping or low-volume production, R&D and universities.

  • Die bonder FINEPLACER® pico ma
  • Flash is required!

Highlights

  • Placement accuracy 5 µm*
  • Components from 0.125 mm x 0.125 mm to 100 mm x 100 mm*
  • Working area up to 450 mm x 234 mm*
  • Supports wafer/substrate sizes* up to 8" *
  • Supports bonding forces up to 400 N*
  • Can be configured as a hot air rework system 
  • Manual and semi-automatic configurations

* depending on configuration and application

Features

  • Automated processes
  • Overlay vision alignment system (VAS) with fixed beam splitter
  • Integrated Process Management (IPM)
  • Real time process observation camera
  • Advanced system software with adaptive process library
  • Process transfer from system to system
  • Process flexibility due to modular concept

Benefits

  • Hands-off die placement, user independent process operation
  • Outstanding placement accuracy and instant operation without adjustments
  • Synchronized control of all process related parameters: force, temperature, time, power, process environment, light and vision
  • Immediate visual feedback reduces process development time
  • Fast and easy process development, process recording and reporting, photo capture
  • Process transfer from R&D to production saves time, guarantees reliable results
  • One system handles a wide variety of applications

Technologies

Applications

Technical Specifications

Placement accuracy:5 µm
Field of view (min)1:1.6 mm x 1.2 mm
Field of view (max)1:20 mm x 15 mm
Component size (min)1:0.125 mm x 0.125 mm
Component size (max)1:40 mm x 40 mm
Theta fine travel:± 6°
Z-travel10 mm 
Working area1:280 mm x 117 mm
Heating temp. (max)1,2*:400 °C
Bonding force (max)1,2*:400 N

* depending on configuration/application
1 standard value, other values on request
2 optional module