Substrate Handling Module
The Substrate Handling Module is designed to handle substrates independently from the bonding tool. Large substrates can be transferred within the machine without tool change.
The rotating feature allows to prealign the substrate at an appropriate angle.
Substrate handling module
Highlights*
- Handles heavy substrates
- Programmable z-travel and z-speed
- Touch down sensor
- Rotatable tool
- Standard vacuum tools are fitting
* depending on configuration
*Technical information are standard values (other values on request). Specification given are subject to change without notice and may not be used as a basis for a binding offer or quotation.