Process Gas Module
The Process Gas Module is an add-on for the Substrate Heating Module. It is designed for soldering processes where a special bonding environment is needed. Its allows using of inert, forming and formic gas (together with Formic Acid Module) in a homogenous gas flow.
The module dimension is depending on the corresponding Substrate Heating Module.
Process gas module
Highlights*
- Application specific chamber openings available
- Retrofittable for various substrate heights
- Adjustable active flow volume
- Easy and fast handling
- Concurrent exhaust capability
* depending on configuration
*Technical information are standard values (other values on request). Specification given are subject to change without notice and may not be used as a basis for a binding offer or quotation.