Looking for?
FINEPLACER® pico ama
Automated Flip Chip BonderThe FINEPLACER® pico ama is a cost effective, fully-automated bonder, offering a high level of application flexibility.
This award winning system is targeted for low volume production environments, as well as product and process development where flexibility is crucial.
Die bonder FINEPLACER® pico ama- Flash is required!
Highlights
- Placement accuracy 5 µm @ 3 sigma*
- Components from 0.125 mm x 0.125 mm to 40 mm x 50 mm*
- Working area up to 450 mm x 117 mm*
- Supports wafer/substrate sizes up to 8" *
- Supports bonding forces up to 50 N*
- Closed loop force control
- Fully automatic operation and assembly process
- Precise non-wearing xy planar table
- Traceability support with open data interface structure
- Flexible, cost effective performance
* depending on configuration and application
* depending on configuration/application
1 standard value, other values on request
2 optional module