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Substrate Heating Module

Substrate Heating Modules are designed to be used with thermocompression, thermosonic, curing or soldering processes.  

Different types of substrate heating modules are available which differ e.g. in dimensions of heated area, power, ramp up speed, holder for waffle pak or gel pak.

Additional process gas modules are available for bonding under controlled atmosphere e.g. to avoid oxidation for alloy AuSn or for reduction of solder material like Indium.

  • Substrate heating module

Highlights*

  • Temperature controlled profile (heating/cooling)
  • Even heat distribution
  • Thermaly compensated heating area
  • Special coated surface
  • Vacuum substrate/tray holder
  • Customized vacuum interposers for odd substrate surfaces
  • Support for process gas (N2/N2H2/formic acid)
  • Add-on Process Gas Module
  • Add-on Formic Acid Module

* depending on system and configuration

Available for FINEPLACER® matrix ma

Substrate Heating Module FA7

Power:1000 W
Heated area:50 mm x 50 mm
Temperature (max):400 °C
Temperature Steadiness:±2 %
Temperature ramps (max): 20 K/s
Tray Holder:    2"
Standard load:    100 N
Reinforced load:500 N
Sales code: FA7

Substrate Heating Module FA9

Power:1200 W
Heated area:100 mm x 100 mm
Temperature (max):400 °C
Temperature Steadiness:±2 %
Temperature ramps (max): 3 K/s
Tray Holder:    1x4" / 4x2"
Standard load:    100 N
Reinforced load:500 N
Sales code:FA9

Substrate Heating Module FA10

Power:250 W
Heated area:20 mm x 20 mm
Temperature (max):400 °C
Temperature Steadiness:±2 %
Temperature ramps (max): 20 K/s
Tray Holder:    2"
Standard load:    20 N
Sales code: FA10

Substrate Heating Module FA11

Power:850 W
Heated area:15 mm x 9 mm
Temperature (max):400 °C
Temperature Steadiness:±2 %
Temperature ramps (max): 100 K/s
Tray Holder:    2"
Standard load:    20 N
Integrated process gas module;
Adaptable for different mounting designs;
Sales code: FA11

*Technical information are standard values (other values on request). Specification given are subject to change without notice and may not be used as a basis for a binding offer or quotation.