Formic Acid Module
The Formic Acid Module is an add-on for the Substrate Heating Module. It's designed to generate formic acid gas for soldering applications (eutectic bonding) to prevent oxidation and keep the surface of solder material like Indium active.
Nitrogen is fed through liquid acid where it is enriched with HCO2H (formic acid) molecules. This gas can be diluted with pure N2 to match the required process concentration.
*Technical information are standard values (other values on request). Specification given are subject to change without notice and may not be used as a basis for a binding offer or quotation.























































