Spinner
 

Die Pick-up Module

The Die Pick-Up Module is used for ejecting a die out of a blue tape presentation frame. Can be used as a presentation stage for bonding face-up or in combination with the Die Flip Module. 

  • Die pick-up module

Highlights*

  • Adaptable to different chip sizes by multiple needles
  • Handles both stretched and unstretched diced wafers
  • No damage to chip backside
  • Easy and safe handling of frames 
  • Supports wafer up to 6"

* depending on configuration

Available for FINEPLACER® lambda

Die Pick-up Module FF1

Wafer size (max):6"
Chip size (min):500 µm x 500 µm
Chip size (max):20 mm x 20 mm
Sales code:FF1

*Technical information are standard values (other values on request). Specification given are subject to change without notice and may not be used as a basis for a binding offer or quotation.