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  • Robert Avila
    Finetech - USA/West
    Phone:
    +1 480 893 1630
    Fax:
    +1 480 893 1632
    Micro AssemblyPartner ReworkPartner
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FINEPLACER® femto

Automated Sub-micron Die Bonder

The FINEPLACER® femto is a fully automated, sub-micron bonding platform for advanced packaging and optoelectronic applications.

This award winning system offers modular application architecture and can be flexibly equipped for a wide range of applications and processes. It is an ideal system for a production environment as well as for product and process development, accommodating the complete production workflow of inspection, characterization, packaging, final test and qualification.

FINEPLACER® femto has the best cost - performance ratio of its class in the market.

  • Die bonder FINEPLACER® femto
  • Flash is required!

Highlights

  • Sub-micron placement accuracy*
  • Handles ultra small to very large components
  • Fully-automated operation and assembly process
  • Supports wafer/substrate sizes up to 12" *
  • Supports bonding forces up to 500 N*
  • Highly flexible platform architecture
  • Small footprint and compact design
  • Long-term stability

* depending on configuration and application

Features

  • Automated pattern recognition, alignment and bonding
  • Overlay vision alignment system with fixed beam splitter in combination with automatic field extension and zoom
  • Integrated Process Management (IPM)
  • Adaptive process library
  • Live process observation camera
  • Virtually unlimited range of advanced bonding technologies

Benefits

  • Fully automated, user independent process
  • Outstanding placement accuracy and instant operation without adjustments
  • Synchronized control of all process related parameters: force, temperature, time, power, process environment, light and vision
  • Fast and easy process development
  • Immediate visual feedback reduces process development time
  • ROI savings - one machine for all applications

Technologies

Applications

Technical Specifications

Placement accuracy*:± 0.5 µm
Field of view (min)1:0.27 mm x 0.2 mm
Field of view (max)1:3.2 mm x 2.4 mm
Component size (min):0.1 mm x 0.1 mm
Component size (max):100 mm x 100 mm
Theta fine travel:± 9° / 3.5 µrad
Z-travel / resolution:10 mm / 0.2 µm
Y-travel / resolution:150 mm / 0.1 µm
X-travel / resolution:450 mm / 0.1 µm
Working area:450 mm x 150 mm
Heating temperature1,2:400 °C
Bonding force range*:0.1 N - 500 N

* depending on configuration/application
1 standard value, other values on request
2 optional module