Micro Assembly

Finetech offers bonding equipment for high-precision assembly, packaging and die attach.  

The modular design of these systems provides maximum process flexibility for many bonding technologies - soldering, adhesive bonding, ultra-/thermosonic, thermocompression and UV curing. 

Typical applications include the bonding and assembly of flip chips, MEMS, MOEMS, laser bars/laser diodes, VCSELs, sensors, CoF, CoG, LEDs/HB-LEDs and RFID.

FINEPLACER® femto 2
Automated Prototype2Production Bonder

  • 0.5 micron accuracy*
  • Production platform
  • Maximum yield

FINEPLACER® femto
Automated Sub-micron Bonder

  • 0.5 micron accuracy*
  • Production platform

FINEPLACER® sigma
Semi-automated Sub-micron Bonder

  • 0.5 micron @ 300mm
  • Bonding forces up to 1000N

FINEPLACER® lambda
Flexible Sub-micron Bonder

  • 0.5 micron accuracy*
  • Application versatility

FINEPLACER® pico ma
Multi-purpose Bonder

  • 5 micron accuracy*
  • Application versatility

* depending on configuration and application

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