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Reballing Module

The Reballing Module allows solder sphere arrays to be restored on custom specified BGA or CSP components after residual solder has been removed. The module works together with the FINEPLACER® top and bottom heating ensuring highly reproducible results. The alignment of stencil and component pads is performed with the rework system's high precision optics.

  • Reballing Module

Highlights

  • Precise reballing
  • Reproducible results
  • Atmosphere similar to reflow oven
  • Supports inert gas atmosphere
  • Minimum thermal stress
  • Optional component vacuum support

* depending on system configuration

Available for FINEPLACER® micro rs

Reballing Module

Component size:all
Ball size range:250 µm - 760 µm
Sales code:RC5

*Technical information are standard values (other values on request). Specification given are subject to change without notice and may not be used as a basis for a binding offer or quotation.