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  • Robert Avila
    Finetech - USA/West
    Phone:
    +1 480 893 1630
    Fax:
    +1 480 893 1632
    Micro AssemblyPartner ReworkPartner
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FINEPLACER® micro hvr

High Volume Rework Station

The FINEPLACER® micro hvr is a cost effective, fully-automated rework station, offering a high level of flexibility.

This award winning system is targeted for production environments where yield is crucial.

  • Rework station FINEPLACER® micro hvr

Highlights

  • Components from 0.25 mm x 0.25 mm to 90 mm x 80 mm*
  • Board sizes up to 350 mm x 260 mm*
  • Closed loop force control
  • Fully automated operation and soldering process
  • Precise non-wearing xy planar table
  • Traceability support with open data interface structure
  • Flexible, cost effective performance
  • Placement accuracy 10 µm @ 3 sigma

* depending on configuration

Features

  • Automated pattern recognition, alignment and soldering
  • Overlay vision alignment system with fixed beam splitter
  • Integrated Process Management (IPM)
  • Adaptive process library
  • Live process observation camera

Benefits

  • Full automatic, user independent process
  • Outstanding placement accuracy and instant operation without adjustments
  • Synchronized control of all process related parameters: force, temperature, time, flow, power, process environment, light and vision
  • Fast and easy process development
  • Immediate visual feedback reduces process development time

Processes

Applications

  • Soldering of:
    • BGA, µBGA/CSP, QFN, PoP, QFP, PGA,
    • Small passives down to 0201
    • RF shields, RF frames
    • Connectors, sockets
    • Sub assemblies, daughter boards
    • Flipchip (C4)
  • Single ball rework

Technical Specifications

Placement accuracy:10 µm @ 3 sigma
Field of view (min)1:2.5 mm x 1.9 mm
Field of view (max)1:17.5 mm x 13 mm
Component size (min)1:0.25 mm x 0.25 mm
Component size (max)1:50 mm x 50 mm
Theta fine travel / resolution:± 4° / 1.0°
X-travel / resolution:380 mm / 0.64 µm
Y-travel / resolution:155 mm / 0.64 µm
Z-travel / resolution:8 mm / 0.8 µm
Top Heating²:
  Power: 900 W
  Temperature ramp rate: 1 K/s - 50 K/s
  Flow range: 10 Nl/min - 70 Nl/min
Bottom Heating²:
  Power: 1400 W 
  Heated area (max): 330 mm x 170 mm
  Flow range: 48 Nl/min

* depending on configuration/application
1 standard value, other values on request
2 optional modules