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Bottom Heating Module

The heat source of the Bottom Heating Module provides heat transfer via inert gas or air. The wide variety of heaters ensures an appropriate solution for various applications. Finetech's approach replaces excessive electrical power application by efficient use of energy.

Bottom Heating Modules are part of the Integrated Process Management system (IPM) which offers software-controlled interaction of top and bottom heating. IPM provides one profile for the entire thermal management of every rework step. The result is minimized thermal load to board and component and a maximum of process reproducibility.

All bottom heaters can be adapted to different board sizes.

Highlights*

  • Even heat distribution
  • Precise board temperature control
  • Reproducible soldering profiles
  • Specific heating and cooling profiles
  • Supports dynamic ramp rates
  • Controlled active cooling function meets JEDEC/IPC standards
  • Preheating capabilities
  • Lead-free approved
  • Adaptable for various PCB sizes

* depending on system and configuration

Available for FINEPLACER® jumbo rs

Bottom Heating Module RB15

Power (max):3500 W 
Gas temperature (max):320 °C
Flow:10 x 16 Nl/min
Flow deviation:±1 Nl/min
Ramp rate:0.1 K/s - 10 K/s
Ramp resolution:0.1 K/s
Heated area (max):475 x 380 mm²
Heated area (min):190 x 95 mm²
Number of heating zones:10
Sales code:RB15

Bottom Heating Module RB20

Power (max):2100 W 
Gas temperature (max):320 °C
Flow:6 x 16 Nl/min
Flow deviation:±1 Nl/min
Ramp rate:0.1 K/s - 10 K/s
Ramp resolution:0.1 K/s
Heated area (max):380 x 285 mm²
Heated area (min):190 x 95 mm²
Number of heating zones:6
Sales code:RB20

*Technical information are standard values (other values on request). Specification given are subject to change without notice and may not be used as a basis for a binding offer or quotation.