Solder Removal Module
The Solder Removal Module allows precise residual solder removal in an inert atmosphere*. Molten solder is easily removed from the board with powerful vacuum without disturbing any pads or solder resist.
The software controlled process allows reproducible results. Depending on component size the process can be finished with one single sweep. Also suitable for cleaning BGA interposers before reballing together with reballing module*.
Solder Removal Module
Highlights*
- Contactless solder removal
- Single sweep working principle
- Safe, careful and reproducible cleaning
- Inert gas atmosphere
- Software controlled
- Low thermal load
- Layout specific solder removal head
* depending on configuration
*Technical information are standard values (other values on request). Specification given are subject to change without notice and may not be used as a basis for a binding offer or quotation.