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  • Robert Avila
    Finetech - USA/West
    Phone:
    +1 480 893 1630
    Fax:
    +1 480 893 1632
    Micro AssemblyPartner ReworkPartner
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FINEPLACER® core

Industry-leading, Cost-effective Rework

The FINEPLACER® core is a compact, yet versatile rework system that offers a level of professionalism that exceeds its attractive price. The system offers proven rework technology for a wide spectrum of SMD components, ranging in size from 0201 up to 90 mm x 90 mm*.

This attractively-priced, compact rework station is based on Finetech’s proven technology integrating the complete rework cycle into an efficient design. Users have precise temperature and gas flow control of convection top and bottom heating.  Additionally, non-contact site cleaning allows braid-free board preparation. The system is at home in production environments where process reproducibility is crucial.

FINEPLACER® core - with a high efficiency small board heater developed for rework of small sized PCBs, e.g. for mobile devices.

  • FINEPLACER<sup>®</sup> core rework station
    FINEPLACER® core rework station

Highlights

  • Components from 0.25 mm x 0.25 mm up to 90 mm x 90 mm*
  • Proven thermal management solution with hot air top and bottom heating
  • Automated processes with force measurement
  • Placement accuracy better than 25 µm
  • Compact, integrated machine design
  • Cost efficient soldering tools, compatible with all FINEPLACER® rework stations


* depending on configuration

Features

  • Automated soldering processes
  • Compact and robust design
  • Vision alignment system with fixed beam splitter
  • Intelligent thermal management
  • Real time process observation camera

Benefits

  • User independent process operation
  • The whole rework cycle within one cost-effective system solution
  • Reproducible placement accuracy
  • Coordinated control of all process parameters: temperature, flow, time, process environment
  • Immediate visual feedback reduces process development time

Processes

Applications

  • Soldering of:
    • BGA, µBGA/CSP, QFN, DFN, PoP, QFP, PGA, SON
    • Small passives down to 0201
    • RF shields, RF frames
    • Connectors, sockets
    • Sub assemblies, daughter boards
  • Pin in Paste (PiP)
  • Trough Hole Reflow (THR)
  • Reworkable underfill, conformal coating

Technical Specifications

Placement accuracy:25 µm
Field of view (min)1:12.1 mm x 7.6 mm
Field of view (max)1:65 mm x 45 mm
Component size (min)1:0.25 mm x 0.25 mm
Component size (max)1:60 mm x 60 mm
Board size (max):350 mm x 310 mm
Board thickness (max):6 mm
Thermocouples:4
Top Heating:
  Power:900 W
  Temperature ramp rate:1 K/s - 50 K/s
  Flow range:10 Nl/min - 70 Nl/min
Board Heating:
  Power:900 W
  Heated area (max):100 mm x 100 mm
  Flow range:10 Nl/min - 70 Nl/min

* depending on configuration/application
1 standard value, other values on request
2 optional modules