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  • Robert Avila
    Finetech - USA/West
    Phone:
    +1 480 893 1630
    Fax:
    +1 480 893 1632
    Micro AssemblyPartner ReworkPartner
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FINEPLACER® core

Energy-efficient, Cost-effective Rework

The FINEPLACER® core is a versatile rework system offering energy-efficient hot gas rework technology for a wide spectrum of SMD components from smallest components to large BGA.

The easy-to-handle machine integrates the complete SMD rework cycle into an compact design, without diminishing functionality. Quite on the contrary, professional features such as automatic calibration, Process Start Sensor, Process Gas Switching, 01005 Rework Package, PCB Recognition and a gesture-based operating interface are available, making the system a future-proof investment.

FINEPLACER® core comes with a high efficiency bottom heating developed for rework of small sized PCBs, e.g. for mobile devices.

With enhanced functionalites, the system is the "Swiss Army Knife" of professional SMD rework.

  • FINEPLACER<sup>®</sup> core rework station
    FINEPLACER® core rework station

Highlights*

  • Components from 0.125 mm x 0.125 mm up to 90 mm x 90 mm
  • Eco-friendly thermal management solution with high-efficiency hot gas top and bottom heating
  • Automatic top heater calibration
  • Automatic pick-up / touch-down with force measurement
  • Automated processes
  • Gesture-based operating interface
  • Compact, integrated machine design
  • Cost efficient soldering tools, compatible with all FINEPLACER® rework stations

* depending on configuration

Features

  • Automated soldering processes
  • Compact and robust design
  • Vision alignment system with fixed beam splitter
  • Intelligent thermal management
  • Real time process observation camera

Benefits

  • User independent process operation
  • The whole rework cycle within one cost-effective system solution
  • Reproducible placement accuracy
  • Coordinated control of all process parameters: temperature, flow, time, process environment
  • Immediate visual feedback reduces process development time

Processes

Applications

  • Soldering of:
    • BGA, µBGA/CSP, QFN, DFN, PoP, QFP, PGA, SON
    • Small passives down to 01005
    • RF shields, RF frames
    • Connectors, sockets
    • Sub assemblies, daughter boards
  • Pin in Paste (PiP)
  • Trough Hole Reflow (THR)
  • Reworkable underfill, conformal coating

Technical Specifications

Placement accuracy:25 µm
Field of view (min)1:12.1 mm x 7.6 mm
Field of view (max)1:65 mm x 45 mm
Component size (min)1:0.25 mm x 0.25 mm
Component size (max)1:60 mm x 60 mm
Board size (max):350 mm x 310 mm
Board thickness (max):6 mm
Thermocouples:4
Top Heating:
  Power:900 W
  Temperature ramp rate:1 K/s - 50 K/s
  Flow range:10 Nl/min - 70 Nl/min
Board Heating:
  Power:900 W
  Heated area (max)²:100 mm x 100 mm
  Flow range:10 Nl/min - 70 Nl/min

Modules & Options

* depending on configuration/application
1 standard value, other values on request
2 optional modules