Automatic Die Bonding

FINEPLACER® femto 2 - High Accuracy Automatic Die Bonder

The high-accuracy die bonding platform FINEPLACER® femto 2 features a placement accuracy of up to ± 0.5 µm @ 3 Sigma and supports a wide range of assembly applications on chip and wafer level. The system is suitable for clients from various branches, including Research & Development, semiconductor industry, communication and medical engineering, as well as sensor production. The FINEPLACER/r) femto 2 is a reliable companion as applications migrate from process and product development to automated low-volume/high-mix product environments.

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