Applying viscous media, such as solder paste or glue, in a secure and reproducible way is a critical factor of success in many assembly and rework applications. The diversity and specific properties of materials (i.e. with low or high viscosity, thixotropic media), as well as design based conditions and application limitations, require a broad range of adapted hardware solutions and technological flexibility.
Customers can benefit from Finetech’s deep knowledge of customer-specific transfer solutions which we have developed over the decades. This includes manual and automatic dispenser feed systems, various dispenser control units from MARTIN, as well as specialized tooling designed to apply, handle and process all kinds of viscous media.
Overview of materials, methods und processing technologies
|Transfer Materials||Transfer Methods||SMD Assembly Technologies||SMD Protection & Sealing|
|Solder paste||Dispensing||Reflow soldering||Underfilling|
|Adhesive / Epoxy||Micro dispensing||Gluing and Curing|
with UV / Snap Curing
|Underfill||Component dipping||Gluing and Curing|
|Dam and Fill|
|Flux||Stamping (Pin Transfer)||Glob Top|