Thermocompression bonding can be used for wire bonding or Flip Chip bonding. It needs contacts made of ductile materials, e.g. stud bumps created from Au wires. These can be located on either the substrate or component. On the opposite side, flat contacts, preferably of the same material, serve as bonding partners.
Without the necessity of liquefying the contact material, thermocompression bonding generates a joint by material engagement, providing acceptable mechanical firmness and steadiness as well as a good electrical conductance. Especially in connection with Flip Chip bonding, this process improves the RF properties of the bonding joint.
What are the Challenges?
- Apply force and heat to the component simultaneously
- Minimize substrate heater's compliance to absorb bonding force without deformation
- Prevent thermal drift of heated area over a large temperature range (requires sophisticated support elements in connection with thermally compensated materials)
- Provide thermally and mechanically stable component heater
- Provide stable, fine resolution bonding force control to bond even the thinnest and most brittle materials, as well as large components with lots of bumps
- Achieve micron range coplanarity between component and substrate (requires adapted tooling or sensors and activators to detect and compensate deviations)
The Finetech Solution
FINEPLACER® Bonding Systems
Due to the modular design approach, FINEPLACER® bonding systems can be configured for virtually any application challenge.
The main distinguishing features between the machines are the
- degree of automation
- optical resolution and
- placement accuracy
Browse our product range or get in contact with your sales contact to figure out the best equipment solution for your specific application requirements.