Au/Sn Soldering

Eutectic Gold/Tin (Au/Sn) is a hard solder alloy often used to bond demanding microelectronic and optoelectronic devices. They are available in different forms, such as pre-forms, solder paste or ribbons.

Au/Sn provides a number of advantages such as high reliability, high melting temperature, excellent resistance to corrosion, good wetting behavior, high thermal conductivity and high surface tension. When process gas is integrated into the process, chemical flux is not necessary.  This is beneficial when bonding optical components by diminishing the risk of pollution.

Au/Sn bonded packages are used in many automotive, medical, aerospace/military and harsh environment applications.  

As the melting point is rather high, Au/Sn bonding is often combined with other soldering processes such as Indium bonding.  When performing sequential bonding or step bonding processes, the use of different melting point materials will prevent previous joints from melting.

  • AuSn soldering - overlay of laser bar
    AuSn soldering - overlay of laser bar

What are the Challenges?

Au/Sn solder alloy is often used to provide solutions when:

  • Highest placement accuracy needed
  • Sensitive components with brittle materials
  • Adapted tooling for delicate edges and facettes
  • Void free bonding is required
  • Control force during the bonding process

The Finetech Solution

I. The Principle of Au/Sn Soldering

After accurate alignment and placement of the chip to the substrate, the chip and substrate are heated up to the melting temperature of the interconnect material. If Au/Sn is used, the process temperature will be about 320°C. Simultaneously force is applied to the chip and controlled during the whole bonding process.

 

 

II. Adapted Tools & Modules

  • Bonding Force Modules supports optimal force control
  • Adapted tool shapes with custom design to protected defined areas
  • Active and passive equalization tools for even bond line
  • Standard and custom enclosures to provide AuSn joints with optimal bonding atmosphere
  • Mask tools, in combination with 2-point alignment, for face-up and face-down assembly

FINEPLACER® Bonding Systems

  • FINEPLACER® femto 2
    Automated Prototype2Production Bonder
  • FINEPLACER® sigma
    Semi-automated sub-micron bonder
  • FINEPLACER® lambda
    Flexible sub-micron die bonder
  • FINEPLACER® pico ma
    Multi-purpose die bonder
  • FINEPLACER® pico ama
    Automated flip chip bonder
  • FINEPLACER® matrix ma
    Semi-automated die bonder

Due to the modular design approach, FINEPLACER® bonding systems can be configured for virtually any application challenge.

The main distinguishing features between the machines are the

  • degree of automation
  • optical resolution and
  • placement accuracy

Browse our product range or get in contact with your sales contact to figure out the best equipment solution for your specific application requirements.

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