Product Videos

Fully automated laser bar/sub mount assembly process with 1mm x 10mm example.  Shows high accuracy alignment steps, bonding with defined overhang, and live observation of soldering process.

The semi-automatic FINEPLACER^® matrix is used for stack assembly of multiple die.  The system picks from waffle pack and places (with accuracy of 3 micron) onto a 12 inch wafer utilizing an epoxy dispenser.

Modularly designed bonder provides a unique spectrum of process capabilities and the highest flexibility in a single platform. Sub-micron accuracy, quality optics and multiple bonding technologies make for an ideal research facility system.

Gold-Tin Laser Bar Bonding requires high accuracy and process control. This videos addresses eutectic bonding:  the application of heat to both laser and C-mount, using a controlled downward pressure, an inert atmosphere and forming gas to produce a flux-less process.

Ultrasonic bonding process on the FINEPLACER^® pico ma shows the accusation and alignment of parts and the running of the process.  This system can handle components up to 100 mm x 100 mm.

Au on Au bonding process combines low temperature heat and force aided by ultrasonic motion - suitable for low to medium I/O count devices.   Finetech systems provide optimized field of view for alignment and visual inspection in-situ. 

Completely automated laser bar/sub mount assembly utilizing IPM software to achieve 5 micron placement accuracy with process repeatability of 3 sigma.  Demonstrates RFID traceability, AuSn soldering, and post-bond alignment measurement.