FineXT 6003

Multi-chip, Multi-placement Die Bonder

The all new FineXT 6003 is a fully automatic large area die bonder with true multi-chip, multi placement capability for high volume manufacturing.

The modular design allows to configure the system for multiple advanced packaging technologies. The machine’s capabilities can be easily enhanced to adapt to new technological trends. Combined with an automatic material handling and tool management system, this ensures a high degree of process flexibility for next-generation optoelectronic and demanding fan-out applications.

In operation, the machine can switch between a high speed mode for optimized throughput and a high-accuracy mode on a per chip base. This makes the FineXT 6003 the perfect solution for modern semiconductor production environments where speed does not compromise highest precision.

  • FineXT 6003

Highlights*

  • Multi-chip capability
  • High placement accuracy
  • Die pick-up from wafers, waffle packs and GelPaks®
  • Hot and cold processes
  • In-line capability
  • Granite based system with air bearings
  • Customizable with modules
  • Fully-automatic operation

Features

  • Dedicated modes for speed and accuracy
  • Very large bonding area
  • Multitasking capability
  • In-line capability
  • Integrated Process Management (IPM)
  • In-situ touchdown sensing and bond force control
  • Front access to all machine parts

Benefits

  • Optimized machine throughput
  • Effective processing of all substrate sizes
  • Increased throughput
  • Factory automation
  • Synchronized control of all process related parameters
  • Reproducible results even with challenging applications
  • Easy to maintain

Technologies

  • Epoxy bonding
  • Eutectic bonding
  • Flip chip
  • Silver sintering
  • Soft solder die attach

Applications

  • Precision die bonding (face up)
  • Flip chip bonding (face down)
  • Optical module assembly (TOSA/ROSA, AOC)
  • Lens attach
  • Laser bar bonding
  • Panel-level packaging
  • Wafer-level packaging /Chip on Wafer (CoW)
  • Chip on Substrate/Submount (CoS)
  • MEMS/MOEMS assembly
  • Hybrid assemblies
  • Sensor assembly

 

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