Substrate heating Module

Substrate Heating Modules are designed to be used with thermocompression, thermosonic, curing or soldering processes.  

Different types of substrate heating modules are available which differ e.g. in dimensions of heated area, power, ramp up speed, holder for waffle pak or gel pak.

Additional process gas modules are available for bonding under controlled atmosphere e.g. to avoid oxidation of alloy AuSn or for reduction of solder material like Indium.

  • Substrate heating module

Highlights*

  • Temperature controlled profile (heating/cooling)
  • Even heat distribution
  • Thermally compensated heating area
  • Special coated surface
  • Vacuum substrate/tray holder
  • Customized vacuum interposers for odd substrate surfaces
  • Support for process gas (N2/N2H2/formic acid)
  • Add-on Process Gas Module
  • Add-on Formic Acid Module

* depending on system and configuration

Available for FINEPLACER® sigma

Substrate Heating Module FA7

Heated area:50 mm x 50 mm
Power:1000 W
Max. temperature (standard):400 °C
Max. temperature (extended):450 °C
Max. ramp rate20 K/s
Max. load (standard)1:    60 N - 100 N
Max. load (extended)1:    400 N - 500 N
Air flow (cooling):80 l/min
Sales code: FA7
1 depending on system

Substrate Heating Module FA9

Heated area:100 mm x 100 mm
Power:1200 W
Max. temperature (standard):400 °C
Max. temperature (extended):450 °C
Max. ramp rate3 K/s
Max. load (standard)1:    60 N - 100 N
Max. load (extended)1:    400 N - 500 N
Air flow (cooling):80 l/min
Sales code: FA9
1 depending on system

Substrate Heating Module FA15

Heated area:50 mm x 50 mm
Power:1700 W
Max. temperature (standard):400 °C
Max. temperature (extended):450 °C
Max. ramp rate30 K/s
Max. load (standard)1:    100 N - 1000 N
Max. load (extended)1:    400 N - 1000 N
Air flow (cooling):80 l/min
Sales code: FA15
1 depending on system

Substrate Heating Module FA16

Heated area:200 mm x 200 mm
Power:2000 W
Max. temperature (standard):300 °C
Max. temperature (extended):-
Max. ramp rate1 K/s
Max. load (standard)1:    400 N - 500 N
Max. load (extended):    500 N
Air flow (cooling):100 l/min
Sales code: FA16
1 depending on system

Substrate Heating Module FA17

Heated area:12 mm x 12 mm
Power:550 W
Max. temperature (standard):450 °C
Max. temperature (extended):500 °C
Max. ramp rate100 K/s
Max. load (standard):    100 N
Max. load (extended)1:    -
Air flow (cooling):55 l/min
Sales code: FA17

Substrate Heating Module FA18 (in combination with Vacuum Chamber Module)

Heated area:42 mm x 42 mm
Power:1000 W
Max. temperature (standard):400 °C
Max. temperature (extended):450 °C
Max. ramp rate10 K/s
Max. load (standard)1:    500 N
Max. load (extended)1:    1000 N
Air flow (cooling):80 l/min
Sales code: FA18
1 depending on system

*Technical data are standard values (other values on request). Specifications given are subject to change without notice and may not be used as a basis for a binding offer or quotation.

Spinner