Dispenser Module

With a Dispenser Module various materials such as adhesives, flux or solder paste can be applied onto substrates, PCBs and components. Another purpose is applying underfill material to components such as BGA or CSP.

The Dispenser Module is composed of a machine specific feeder system (support) and a suitable device to control the dispensing parameters (subject to individual requirements).


  • Defined dispensing position using high precision vision alignment system
  • Allows dispensing materials with fluid and paste-like viscosity
  • Precise adjustment with micrometer screws in x, y, z
  • Supports various cartridge sizes
  • Cartridge and needle cooling
  • Automatic drip-catcher
  • Quick clamping system
  • Feeding system supports various dispenser types: time-pressure, valve, screw and jet

* depending on system and configuration

Available for FINEPLACER® sigma

Dispenser Support - FG2

Operation:Software controlled
Feed motion:motorized
Syringe barrel type:3 ccm, 5 ccm
Tip lengths:1/2"
Dispense angle: 60°
Dispenser position:Left-Front
Sales code:FG2

Dispense-Control - Clever Dispense 06

Dispense volume:0.0005 - 10 mm³
Medium delivery pressure0.2 bar – 7.0 bar (adjustable)
Temperature comp.: 10°-50°C
Suck-back vacuum:yes (self teaching)
Sales code:FG2.D
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*Technical data are standard values (other values on request). Specifications given are subject to change without notice and may not be used as a basis for a binding offer or quotation.