Die Pick-up Module

The Die Pick-Up Module is used for ejecting a die out of a blue tape presentation frame. Can be used as a presentation stage for bonding face-up or in combination with the Die Flip Module

  • Die Pick-up Module

Highlights*

  • Adaptable to different chip sizes by multiple needles
  • Handles both stretched and unstretched diced wafers
  • No damage to chip backside
  • Easy and safe handling of frames 
  • Supports wafer from 4" -12" **

* depending on system and configuration
** depending on wafer frame size and FINEPLACER® system

*Technical data are standard values (other values on request). Specifications given are subject to change without notice and may not be used as a basis for a binding offer or quotation.

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