Die Flip Module

The automatic Die Flip Module is designed for general flip chip bonding applications. When a die is presented in the wrong way (face up) this unit flips the components into the face down position.

  • Die Flip Module (automatic)


  • Safe vacuum-based handling of sensitive components
  • Easy adaptation from small to large components
  • Accommodates various chip heights
  • Contact speed adjustable
  • Synchronized process integration

* depending on configuration

Available for FINEPLACER® sigma

Die Flip Module FF3

Chip height (max):4 mm
Chip size (min):200 µm x 200 µm
Chip size (max):20 mm x 20 mm
Sales code: FF3

*Technical data are standard values (other values on request). Specifications given are subject to change without notice and may not be used as a basis for a binding offer or quotation.