With a Dispenser Module various materials such as adhesives, flux or solder paste can be applied onto substrates, PCBs and components. Another purpose is applying underfill material to components such as BGA or CSP.
The Dispenser Module is composed of a machine specific feeder system (support) and a suitable device to control the dispensing parameters (subject to individual requirements).
- Defined dispensing position using high precision vision alignment system
- Allows dispensing materials with fluid and paste-like viscosity
- Precise adjustment with micrometer screws in x, y, z
- Supports various cartridge sizes
- Cartridge and needle cooling
- Automatic drip-catcher
- Quick clamping system
- Feeding system supports various dispenser types: time-pressure, valve, screw and jet
* depending on system and configuration