The ACF (Anisotropic Conductive Film) Module consists of the ACF tool and a separate control box. It enables 'pre-bonding' of transparent und non transparent ACF-adhesive film.The module allows unobstructed view of chip and substrate during alignment to guarantee highest placement accuracy.
Available for FINEPLACER® pico ma
High Force ACF Bonder
As the versatile FINEPLACER® pico ma system continues to evolve, a new optional configuration has been developed for the latest Anisotropic Conductive Film (ACF) applications.
- Bonding forces up to 700 N
- 5 micron placement accuracy
- Outstanding tool coplanarity
- Unrivaled application flexibility
ACF technology is used in chip-on-glass (COG), flex-on-glass (FOG), flex-on-board (FOB), flex-on-flex (FOF), chip-on-flex (COF), chip-on-board (COB), and similar applications for higher signal densities and smaller overall packages. For bonding, the amount of thermal energy required is higher due to the need to first flow the adhesive and allow the two sides to come together into electrical contact, and then to cure the adhesive and create a lasting reliable bond.