ACF Module

The ACF (Anisotropic Conductive Film) Module consists of the ACF tool and a separate control box. It enables 'pre-bonding' of transparent und non transparent ACF-adhesive film.The module allows unobstructed view of chip and substrate during alignment to guarantee highest placement accuracy.

  • ACF Module


    • Used for ACF pre-bonding
    • Integrated heater 
    • Teflon coated tool tip for various chip sizes
    • Suitable for using opaque ACF
    • High reproducibility
    • Automatic/manual bonding force

    * depending on configuration

    Available for FINEPLACER® pico ma

    ACF Module FG1

    • ACF Module
    Pre-bonding Power (max):80 W
    Temperature (max):120° C
    Temperature ramp (max):3 K/s
    Film size (min):2 mm x 2 mm
    Film size area A (max):16 mm x 14 mm
    Film size area B (max):3.5 mm x 28 mm
    Sales code:FG1

    High Force ACF Bonder

    • High Force ACF Bonder
      Multi-purpose ACF Bonder for Bond Forces up to 700 N

    As the versatile FINEPLACER® pico ma system continues to evolve, a new optional configuration has been developed for the latest Anisotropic Conductive Film (ACF) applications. 

    • Bonding forces up to 700 N
    • 5 micron placement accuracy
    • Outstanding tool coplanarity
    • Unrivaled application flexibility


    About ACF

    ACF technology is used in chip-on-glass (COG), flex-on-glass (FOG), flex-on-board (FOB), flex-on-flex (FOF), chip-on-flex (COF), chip-on-board (COB), and similar applications for higher signal densities and smaller overall packages.  For bonding, the amount of thermal energy required is higher due to the need to first flow the adhesive and allow the two sides to come together into electrical contact, and then to cure the adhesive and create a lasting reliable bond.

    *Technical data are standard values (other values on request). Specifications given are subject to change without notice and may not be used as a basis for a binding offer or quotation.