High Force ACF Bonder

Bonding forces up to 700 N with outstanding coplanarity

As the versatile FINEPLACER® pico ma system continues to evolve, a new optional configuration has been developed for the latest Anisotropic Conductive Film (ACF) applications.

Today's ACF challenges are often characterized by enlarged bond areas and multi chip settings. Therefore, the machine's mechanical structure was reinforced to provide extra sturdiness and the ability to apply higher bonding forces. A novel 700N Bonding Force Module as well as a new Multi-Chip Transfer Station were integrated into the new setup to complement the Precision z-Hub Positioning Table for high forces as well as the ACF Module.

With a FINEPLACER® pico configured for ACF applications, up to 4 components can be placed simultaneously and bonded with defined distances of only a few microns. Applied bonding forces of up to 700 N while maintaining outstanding tool coplanarity ensure a coherent and durable bond between chips and Anisotropic Conductive Films.

  • FINEPLACER® pico ma - ACF Bonding Configuration 700 N

Highlights

  • Placement accuracy 5 µm*
  • Components from 0.125 x 0.125 mm2 to 40 x 40 mm2 *
  • Working area up to 450 mm x 122 mm*
  • Supports wafer/substrate sizes* up to 8" *
  • Supports bonding forces up to 700 N*
  • Outstanding tool coplanarity over the complete force range
  • Manual and semi-automatic configurations
  • Quick Chip Heating Module allowing temperature ramps up to 20 K/s
  • Substrate Heating Module with heated area of 50 x 50 mm² and temperature ramps up to 20 K/s
  • Multi-Chip Transfer Station with separate vacuum switching

* depending on configuration and application

Features

  • Automated processes
  • Overlay vision alignment system (VAS) with fixed beam splitter
  • Real time process observation camera
  • Quick temperature processes
  • Multi-chip handling
  • Integrated ACF support, suitable for non-transparent ACF
  • Pneumatic Bonding Force Module up to 700 N

Benefits

  • Automated die pick-up and placement of chips
  • High-precision chip placement with defined distances, realized via transfer station with glass mask
  • Synchronized temperature and force processes
  • Integrated ACF tool with heating function
  • Optics shifting for alignment of long chip edges
  • Outstanding placement accuracy
  • Quick and easy process development

Applications

Configuration & Specs

Positioning TableReinforced design
Quick Clamping Chuck
Integrated theta rotation
Z-travel 10 mm
Vision Alignment SystemPlacement Accuracy ±5 micron
Manual Zoom Camera 12x
Field of View (min.): 1.6 mm x 1.2 mm
Field of View (max): 20 mm x 15 mm
Placement ArmTheta rotation ±6° 
Substrate Heating Module FA7100 x 100 mm
Heated working area: 50 x 50 mm²
Up to 400°C, 1200W
Forced Cooling
Vacuum Substrate Support (Single, Double Chip)
Chip Heating Module FB6C 300 W, ceramic
Up to 400°C
Bonding Force Module FD7.3Up to 700N
ACF Module FG1Up to 120°C
Ultrasonic Module FE440 W
Dispense Support Module FG3Front, 60°
Clever-Dispens-05
Optics Shifting ..SH885 mm
Process Video Module optional
Transfer Station2 separate vacuum structures
Vacuum Switch PanelAdditional vacuum channels
Fiber Optics Illumination

About ACF

ACF technology is used in chip-on-glass (COG), flex-on-glass (FOG), flex-on-board (FOB), flex-on-flex (FOF), chip-on-flex (COF), chip-on-board (COB), and similar applications for higher signal densities and smaller overall packages.  For bonding, the amount of thermal energy required is higher due to the need to first flow the adhesive and allow the two sides to come together into electrical contact, and then to cure the adhesive and create a lasting reliable bond.

* depending on configuration/application
1 other values on request and depending on configuration
2 optional module

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