Bonding Force Module (manual)
Manual Bonding Force Modules are designed to be used for thermocompression, ultrasonic, curing and soldering processes. They are available in different versions to meet the various requirements of custom specified bond applications.
The module is manually driven by the force of a lever weight system. Adjustments depending on operator handling.
Highlights*
- One handed operation
- Force scale for easy adjustment
- Economic solution
- Different force ranges available
* depending on system and configuration
Available for FINEPLACER® lambda
Bonding Force Module FD3.1
| Force (min): | 0.1 N |
| Force (max): | 20 N |
| Resolution: | 0.1 N |
| Sales code: | FD3.1 |
Bonding Force Module FD3.2
| Force (min): | 1 N |
| Force (max): | 40 N |
| Resolution: | 1 N |
| Sales code: | FD3.2 |
Bonding Force Module FD3.3
| Force (min): | 2 N |
| Force (max): | 100 N |
| Resolution: | 3 N |
| Sales code: | FD3.3 |
Bonding Force Module FD3.4
| Force (min): | 20 N |
| Force (max): | 200 N |
| Resolution: | 5 N |
| Sales code: | FD3.4 |
Bonding Force Module FD3.5
| Force (min): | 40 N |
| Force (max): | 400 N |
| Resolution: | 10 N |
| Sales code: | FD3.5 |
*Technical information are standard values (other values on request). Specification given are subject to change without notice and may not be used as a basis for a binding offer or quotation.