FINEPLACER® femto 2

Automated Prototype2Production Bonder

The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.5 µm @ 3 sigma. A complete machine enclosure allows very demanding applications in a controlled environment. Fully protected from external influences, the system stands for highly stable assembly processes with the focus on maximum yield.

The new generation of the femto platform adds numerous innovations to the proven technical basis. This includes the cutting-edge FPXvisionTM. Combined with a refined pattern recognition, this all-new Vision Alignment System opens up a new dimension of application flexibility and accuracy. IPM Command, the fully revamped FINEPLACER® operating software, supports a consistent, ergonomic and clearly structured process development.

Depending on the requirements, the modular FINEPLACER® femto 2 can be individually configured and retrofitted at any time to support new applications and technologies. This makes the system a perfect tool and reliable companion as applications migrate from product development to production. It covers the entire workflow of inspection, characterization, packaging, final test and qualification in semiconductor, communications, medical and sensor technologies.

  • Die-Bonder FINEPLACER® femto 2

Highlights*

    • Placement accuracy 0.5 µm @ 3 sigma
    • Fully-automated operation
    • Manual operating routines available
    • Controlled process environment with cleanroom quality
    • Operator protection from emissions (lasers, UV sources, gasses)
    • Full process access and quick process setup
    • FPXvisionTM: maximum resolution across large field of view
    • Ergonomic operating concept with touch screen interface
    • Modular design allows individual configurations

    Features

    • Pattern recognition for automated placement and bonding processes
    • High optical resolution across a large object field
    • Integrated Process Management (IPM)
    • IPM Command: library based operating software of the next generation
    • Live process observation
    • Virtually unlimited variety of advanced bonding technologies

    Benefits

    • User independent process operation ensures stability, accuracy and optimal yield
    • Outstanding placement accuracy with large components and substrates
    • Synchronized control of all process related parameters: force, temperature, time, power, process environment, light and vision
    • Fast, modular process development with graphical user interface
    • Immediate visual feedback reduces process development time
    • Use one system from product development to production

    Technologies

    Applications

    Technical Specifications*

    Placement accuracy*:0.5 µm @ 3 sigma
    Field of view:3.8 mm x 2.7 mm
    Native camera resolution:1µm / pix
    Extended field of view:83 mm x 2,7 mm
    Component size (min):0.05 mm x 0.05 mm
    Component size (max):100 mm x 100 mm
    Component thickness1:0.01 - 10 mm
    Substrate size:on customer request
    Substrate thickness (max)1:35 mm
    Theta fine travel / resolution:± 9° / 3.5 µrad
    Z-travel / accuracy:10 mm / 0.2 µm
    Y-travel / accuracy:150 mm / 0.1 µm
    X-travel / accuracy450 mm / 0.1 µm
    Heating temperature2:450 °C
    Bonding force range*:0.05 N - 500 N

    * depending on configuration/application
    1 other values on request and depending on configuration
    2 optional module

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