Finetech offers bonding equipment for high-precision assembly, packaging and die attach.
The modular design of these systems provides maximum process flexibility for many bonding technologies - soldering, adhesive bonding, ultra-/thermosonic, thermocompression and UV curing.
Typical applications include the bonding and assembly of flip chips, MEMS, MOEMS, laser bars/laser diodes, VCSELs, sensors, CoF, CoG, LEDs/HB-LEDs and RFID.
Automated Sub-micron Bonder
- 0.5 micron accuracy*
- Production platform
* depending on configuration and application