Scrubbing Module
The Scrubbing Module is a fine-rotation placement arm enhanced with scrubbing capability. It is used to improve the wetting condition of bonding surfaces (void reduction) of precisely aligned bond partners for an improved solder result. Oxyde layers on their contact areas will be cracked in a mechanical sonic process.
Placement accuracy is not affected by scrubbing.
Highlights*
- Improved wetting conditions
- Increased live time of soldering result
- Software controlled scrubbing parameters: duration, direction, amplitude, frequency
- Provides bond forces up to 10 N
- Easy to use
* depending on configuration
*Technical information are standard values (other values on request). Specification given are subject to change without notice and may not be used as a basis for a binding offer or quotation.