Laser Characterization
The versatile multi-purpose die bonder FINEPLACER® pico ma can be modified to perform as cost-effective and flexible testing device, ie. for high power, single or communication lasers. Various equipment can be integrated for optical capacity measuring.
For this purpose, the component to be tested and characterized has to be aligned and placed exactly onto a heat sink using the FINEPLACER® Visual Alignment System. Now the component can be supplied with defined current. A ceramic heater allows test runs under various temperature conditions.
What are the Challenges?
- Manually or fully-automated alignment and placement process
- Suitable method for bare and bonded laser devices
- Proper tooling, bond force and vacuum control
- Integrate customized measuring equipment (diode driver, integrating sphere etc.)
- Perform various testing methods: LIV, spectral, near field, far field
The Finetech Solution
Laser Characterization Kit (LCK)
The Laser Characterization Kit (LCK) is a retrofit configuration for the FINEPLACER® pico ma.
In close co-operation with the customer, Finetech develops comprehensive solutions adapted to specific requirements. The modular approach and state-of-the-art interface solutions ensure integration of third party testing and measuring equipment, such as the laser diode driver or an integrating sphere.
An LCK may typically contain:
- Ceramic Heater for heating from below
- Adapted tray holder for GelPaks or other carrier solutions
- Ceramic transfer plate for temporary laser bar deposition
- Adapted vacuum control tray holder and transfer plate
- Interface and connection solutions
- Gimballed Laser Bridge Tool for the FINEPLACER® placement arm
- Modified Bonding Force Module for small forces adapted to the special design of the Laser Bridge Tool
- Customized mechanical superstructures for third party testing equipment
Laser Bridge Tool
Laser Bridge Tool
The Laser Characterization Kit comes with Laser Bridge Tools which can be used with your standard FINEPLACER® placement arm.
The Laser Bridge Tool is suitable for laser bars with dimensions from 8 mm x 1 mm to 11 mm x 2.5 mm.
The gimbal design of the Laser Bridge Tool automatically ensures X-axis parallelism when the laser bar is placed onto the heat sink. In order to allow parallelism along the Y-axis, the rear part of the tool is height-adjustable.
If required, the Laser Bridge Tool can be easily exchanged with a standard pick and place tool for FINEPLACER® bonding systems.
Integrated Process Management (IPM)
Integrated Process Management (IPM)
Principle of process gas integration
Operating software for bonding
The Integrated Process Management (IPM) is the center piece of a FINEPLACER® system1 - the place where it all comes together. IPM is more than just thermal management. It synchronizes the control of all process modules and their related parameters:
- Controlled and precisely balanced interaction of top and bottom (pre-)heating and cooling
- Control of temperature, time, force, power, energy, flow
- Controlled process gas integration for reduced solder contamination, minimized surface tension effects and smooth spherical solder residues
IPM is very complex, yet easy to access. Via the GUI of the operating software, the user has perfect control of all required adjustments. Just drag 'n drop to define temperature ramps or activate process modules. All settings are represented in only one profile, making for a very intuitive work flow.
The operating software provides an ever-growing library of profiles for all kinds of processes. It also offers comprehensive data logging functions essential for statistical process control.
In combination with the system-to-system process transfer capability this is as easy as process development can get.
1 FINEPLACER® core offers co-ordinated top and bottom heating but does not support IPM