Large Component/Wafer Scale Assembly

Customers in sensor production, medical technologies, automotive, etc. are frequently presented with the challenge to introduce high-accuracy assembly processes for large components or wafers.

Panels with sizes up to 6" x 8" (ie. IR sensors, TFT flat panel detectors, nanofluid flow chambers, micro fluid systems, parallel-plate flow chambers, micro reactors, color and multispectral filters, etc.) require assembly equipment with a specific set of skills. The same holds true for components which are bonded at wafer level in order to optimize process times and decrease average cost per unit (i.e. micro optics, wafer-scale CCD and CMOS, stacked memory, 3D packages, etc.).

A viable equipment solution should provide a post-bond accuracy of 3 µm or better. This is achieved by combining a high-resolution vision alignment system, large substrate heating options with uniform heat distribution, elevated bonding forces for high bump count, a reliable coplanarity control and the ability to integrate multi point alignment for components exceeding the field of view.

The Finetech Solution

  • High resolution optics with extended visual process observation
  • Heated 8 inch wafer chuck: uniform heat distribution, independent level adjustment for bond zones
  • Placement arm retrofit to hold large components, with active coplanarity control
  • Controlled bonding forces up to 1000 N
  • Independent panel / wafer presentation
  • Soldering, glueing (DAF), diffusion bonding etc.

Recommended FINEPLACER® Systems

  • FINEPLACER® matrix ma
    Semi-automated die bonder
  • FINEPLACER® sigma
    Semi-automated sub-micron die bonder
  • FINEPLACER® femto 2
    Automated sub-micron die bonder

FINEPLACER® matrix ma - semi-automated die bonder with up to 3 µm placement accuracy, maximum technological versatility and 300 mm wafer capability.

FINEPLACER® sigma - a semi-automatic bonding system providing sub-micron accuracy, high force bonding up to 1000 N and 300 mm wafer support.

FINEPLACER® femto 2 - fully automated Prototype2Production die bonder with a placement accuracy of 0.5 µm @ 3 Sigma.

Browse our product range or get in contact with your sales contact to figure out the best equipment solution for your specific application requirements.

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