In the high precision world of medical electronics R&D and manufacturing, the requirements are particularly high for quality, reliability for long-term environments, space and weight. Packaging challenges in the biomedical engineering field deal with miniaturization, ultra thin and light form factors, as well as high mix and low volume scenarios.
Whether it’s medical imaging, patient monitoring, diagnostics or drug delivery devices, Finetech’s die bonding and rework systems offer the accuracy and process flexibility to meet the demands of medical device technologies and rapid prototype development. With capabilities such as high force and ACF/ACP bonding, small die handling, and high density rework, our systems have the specifications preferred for today’s medical applications.
“Finetech worked closely with our team of engineers to understand the process sequences, alignment requirements, and process parameters of our very unique applications. Finetech delivered a customized machine incorporating novel alignment and bonding functionality which enabled us to meet the precision and process capabilities our applications demand. The custom solutions Finetech provided continue to be leveraged across new products and have become an integral part of our manufacturing line.”
Tim C., Product Development Engineer, Philips Healthcare
For medical / bioengineering applications, our FINEPLACER® lambda or FINEPLACER® sigma systems are an ideal fit.
FINEPLACER® lambda - a versatile, sub-micron placement die bonder offering the highest process and application flexibility.
FINEPLACER® sigma - a semi-automatic bonding system providing sub-micron accuracy, high force bonding up to 1000N and 300 mm wafer support.