On March 10, 2016, Finetech will hold the Micro Assembly Day 2016. This one-day conference is a platform for active knowledge-sharing and networking, aimed at experts and interested professionals from industry and science. It highlights current advanced packaging technologies and applications and offers insight in the latest micro assembly trends and concepts. High-profile speakers from industry and science will provide in-depth information on the current state of technology as well as their actual implementation in current market applications.
As a long-standing technology partner for assembly and packaging, Finetech offers a wide range of expertise. Accordingly, the thematic agenda of the Micro Assembly Day is dedicated to a variety of trending topics, such as laser-assisted bonding, precision vacuum die bonding, ACF bonding or sinter process integration in high-accuracy assembly applications.
Please note: the Micro Assembly Day 2016 is already fully booked. Thanks for the great response!