Sep 15-19, 2014Location:Berlin, GER
Sep 16-18, 2014Location:Paris, FRA
Sep 22-24, 2014Location:Cannes, FRA
Sep 23-25, 2014Location:Bangalore, IND
Sep 30 - Oct 1, 2014Location: Rosemont, IL
Sep 30 - Oct 3, 2014Location:Utrecht, NED
Oct 14-15, 2014Location: San Diego, CA
Oct 15-17, 2014Location:Yokohama, JPN
Oct 16, 2014Location: Timisoara, RO
Oct 28-30, 2014Location:St. Petersburg, RUS
On August 1, 2014, Finetech has opened its third Sales and Support Center in Asia - Finetech Nippon Co., Ltd.
Georgia Tech Packaging Research Center has selected Finetech's semi-automatic FINEPLACER® matrix bonder to demonstrate the first manufacturable, low-temperature, ultra-fine pitch...
Laying of the foundation stone for modern company building.
Gilbert, AZ – March 11, 2014 – Finetech & Martin, global suppliers of advanced rework and high accuracy bonding equipment, will reveal and demonstrate their latest rework...
As of now, Finetech will be represented in the Czech Republic and Slovakia by ABE.TEC, sro.
Solid state lasers are versatile, light-emitting optical units which can be found in a variety of industrial applications. They combine the valuable physical characteristics of...
The assembly and packaging of optoelectronic devices is one of the key applications in the division of micro assembly. Dense packaged multiplex transmitters, receivers and...
Optical packages are comprising optical and electronic components.
Flexible substrates are used in 3D connection and mechatronic concepts for reducing the number of connectors needed. They can stand high dynamic bending and ...
01005 small passive components are becoming more and more important these days (Integration, miniaturisation, etc.). Finetech offers a complete solution
BGA Rework has become synonymous for SMT Rework in general. Many users’ needs focus around BGA/CSP/Flip Chip, so information found here provides a general background, applicable not only to array packages, but ...