• FINEPLACER lambda

    Sub-micron Opto Bonder

    Outstanding optical resolution and instant operation

  • FINEPLACER femto 2

    Automatic Sub-micron Bonder

    for ultra precision flip chip and die attach

Precision Vacuum Die Bonding

Precision die bonding under vacuum offers many advantages and allows processes otherwise unattainable at atmospheric pressure. Under vacuum, hermetic sealing is [...] Read more

FC Bonding to Organic Substrates

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