• FINEPLACER femto 2

    FINEPLACER® femto 2

    Flexibility | Accuracy | Yield

  • FINEPLACER sigma

    FINEPLACER® sigma

    Sub-micron accuracy | Bond forces up to 1000 N | 300 mm wafer capability

  • Micro Assembly Day 2016

    Micro Assembly Day | Mar 10, 2016

    Knowledge-sharing with micro assembly experts and users

Precision Vacuum Die Bonding

Precision die bonding under vacuum offers many advantages and allows processes otherwise unattainable at atmospheric pressure. Under vacuum, hermetic sealing is [...] Read more

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