On October 10, 2013, Finetech held its annual 'International Micro Assembly Day' in Berlin, bringing together customers, equipment developers and application engineers.
Visitors from various European and Asian countries took the opportunity to discuss the latest developments and future trends, challenges and solutions. Beside a series of enlightening presentations by top-level representatives of the industry as well as Finetech engineeers the participants had the chance to discuss individual projects in detail directly at the FINEPLACER® die bonding systems. Finetech application specialists provided consultation on customer projects and gave valuable advice for selected assembly and packaging challenges.
Date and location of the next edition of the 'International Micro Assembly Day' in 2014 will be published in time via the company website or Facebook. As always, early registration is heavily recommended as the number of participants is limited.