BGA Rework

BGA Rework has become synonymous for SMT Rework in general. Many users’ needs focus around BGA/CSP/Flip Chip, so information found here provides a general background, applicable not only to array packages, but also to the broader SMT Rework market.

Large sphere arrays (BGA), and small fine pitch arrays (CSP) demand configurations that combine precise thermal management and high resolution optics, to ensure a void-free rework process and accurate alignment.

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