BGA Audio Chip Repair on Smartphone Board

Below videos demonstrate a complete rework cycle process for a ball grid array audio chip on a smartphone board with a FINEPLACER® pico rs.

Audio Chip Repair - Process Steps

  • Flash is required!
  • Flash is required!
  • Flash is required!
  • Flash is required!
  • Flash is required!
  • Flash is required!
  • Flash is required!
  • Flash is required!
  • 1st - Desoldering Shielding: Desoldering the RF shield in order to get access to the audio chip
  • 2nd - Underfill Cutting: Cutting underfill fillets in preparation of the de-soldering process
  • 3rd - Desoldering the audio chip
  • 4th - Solder Removal (PCB):  Removing residual solder from the board
  • 5th - Solder Removal (BGA): Removing residual solder from the contact pads
  • 6th - Single Ball Rework: Reworking a single solder ball of the BGA
  • 7th - BGA Reballing: Reballing the ball grid array (if single ball rework is not viable)
  • 8th - Soldering BGA: Soldering the audio chip onto the smartphone board before soldering the RF-shield again.

 

 

Spinner