01005 Small Passives Rework

01005 small passive components (and 03015) are becoming more and more important these days (Integration, miniaturisation, etc.). Finetech offers a complete solution including component re-alignment or removal, site cleaning and optional paste application and replacement with the industries best optical resolution – incorporating real-time inspection during the process.

Rework of a 01005 Passive - Process Steps

  • Flash is required!
  • Flash is required!
  • Flash is required!
  • Flash is required!
  • Flash is required!
  • Flash is required!
  • 1st - Desoldering: The defect components has to be de-soldered without affecting adjacent components. An optimized optical resolution, sufficient magnification, adapted tool design as well as precisely adjusted heat input is required to manage this.
  • 2nd - Residual solder removal: Residual solder will be removed contactless by using a specialized vacuum-based solder removal head. Again, a main challenge is to avoid harm of neighbored components even with tiny clearances like this. Use the process camera for real-time multi-angle perspective visual feedback of the solder removal step and the entire rework process.
  • 3rd - Dispensing: A dispensing unit is used to apply fresh solder material onto the PCB contact pads.
  • 4th - The result: As you can see in the video, the solder paste can be applied with highest accuracy and precisely dosed.
  • 5th - Pick-up: Usually, the new component will be picked up from a strip or tape. A dedicated component presentation module makes picking up the chip a breeze. Pick up and solder in the 01005 small passive using the same tool.
  • 6th - Reflow: The 01005 component is soldered in with software-controlled local heat input (optionally employing nitrogen) and optimal force control for maximum safety and reliable results.
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