Laser Bar BondingSemiconductor lasers are versatile, light-emitting optical units which can be found in a variety of industrial applications. 
RFID AssemblyRFID (Radio Frequency Identification) tags are used as an alternative to bar codes for inventory control and theft protection. 
VCSEL & Photo DiodeThe assembly and packaging of optoelectronic devices is... 
Chip-on-Glass (CoG)Chip-On-Glass is a flip chip technology for direct connection assembly of ICs on glass substrates by using adhesive materials.
Optical Package AssemblyOptical packages are assemblies comprising optical and electronic components.
Ultrasonic / Thermosonic BondingUltrasonic / thermosonic bonding is a connection process that does not need bonding wires and is mainly used for Flip Chips.
ThermocompressionThermocompression bonding is a connection process that does not need bonding wires. It is mainly used in case of Flip Chip bonding.
Adhesive TechnologiesAdhesive materials can be applied between two join partners in various ways.
FINEPLACER® femtoAutomated Sub-micron Die BonderUp to 0.5 micron accuracy
FINEPLACER® matrix maSemi-automatic Die BonderUp to 3 micron accuracy
FINEPLACER® lambdaFlexible Sub-micron Die BonderUp to 0.5 micron accuracy
FINEPLACER® pico maMulti-purpose Die BonderUp to 5 micron accuracy
FINEPLACER® pico amaAutomated Flip Chip BonderUp to 5 micron accuracy
Product VideosFind an video overview of all FINEPLACER® bonder systems.
Rework of BGA / CSPBGA Rework has become synonymous for SMT Rework in general. Learn more...
Rework of Shielded SMDAs PCB real-estate continues to be in high demand, the RF shield design will remain a challenge to rework. 
QFN ReworkFlat packages such as QFN provide many benefits but make much higher demands compared to the handling of standard SMD components.
Small Passives Rework01005 small passive components are becoming more and more important these days (Integration, miniaturisation, etc.).
Package on Package (PoP)Package on Package (PoP) is an IC-packaging technology with vertical combined logic and memory components where ...
Underfill ReworkUnderfilled chips are used in consumer electronics, automotive industry or many miniaturized product.
Chip-on-Flex ReworkFlexible substrates are used in 3D connection and mechatronic concepts for...
Flip Chip ReworkFlip Chip rework is becoming more important in order to save costs by recycling valuable materials.
Single Ball ReballingFinetech offers reliable reballing solutions for single ball replacement down to 200 µm dia.
Array ReballingThe accurate placement a new array of solder spheres is called array reballing.
Residual Solder RemovalThis section deals with the process related issue of eliminating residual solder once a component has been removed from a PCB. 
Apply Solder PasteFinetech offers various equipment solutions to integrate the suitable solder application method into the rework cycle.
FINEPLACER® coreEnergy-efficient, Cost-effective ReworkProven technology where process reproducibility is critical
FINEPLACER® coreplusEnergy-efficient, Cost-effective ReworkProven technology where process reproducibility is critical
FINEPLACER® jumbo rsLarge Area Rework StationBoard sizes to 750 mm x 500 mm
FINEPLACER® pico rsHigh Density Rework StationRework in high density environments
FINEPLACER® micro rsHot Air SMD Rework StationLarge field of view
FINEPLACER® micro hvrHigh Volume Rework StationBoard sizes to 350 mm x 260 mm
FINEPLACER® matrix rsFuture in Advanced ReworkSmallest pitch, most complex integration, largest array device capable
Related EquipmentUseful Enhancements for FINEPLACER® SystemsBGA reballing, preheating
Product VideosSelected product and application videos from the FINEPLACER® rework system range.FINEPLACER® femtoAutomated Sub-micron Die BonderUp to 0.5 micron accuracyFINEPLACER® matrix maSemi-automatic Die BonderUp to 3 micron accuracyFINEPLACER® lambdaFlexible Sub-micron Die BonderUp to 0.5 micron accuracyFINEPLACER® pico maMulti-purpose Die BonderUp to 5 micron accuracyFINEPLACER® pico amaAutomated Flip Chip BonderUp to 5 micron accuracyProduct VideosFind an video overview of all FINEPLACER® bonder systems.FINEPLACER® coreEnergy-efficient, Cost-effective ReworkProven technology where process reproducibility is criticalFINEPLACER® coreplusEnergy-efficient, Cost-effective ReworkProven technology where process reproducibility is criticalFINEPLACER® jumbo rsLarge Area Rework StationBoard sizes to 750 mm x 500 mmFINEPLACER® pico rsHigh Density Rework StationRework in high density environmentsFINEPLACER® micro rsHot Air SMD Rework StationLarge field of viewFINEPLACER® micro hvrHigh Volume Rework StationBoard sizes to 350 mm x 260 mmFINEPLACER® matrix rsFuture in Advanced ReworkSmallest pitch, most complex integration, largest array device capableRelated EquipmentUseful Enhancements for FINEPLACER® SystemsBGA reballing, preheatingProduct VideosSelected product and application videos from the FINEPLACER® rework system range.Rework of QFN/MLFThe Direct Component Printing Module is an optional module available for all FINEPLACER® rework systems. It fully integrates into the rework cycle and provides a very effective, uncomplicated and time-saving method to improve QFN or other MLF rework yield. No second reflow process is necessary which allows a rework result in OEM quality. |
