FINEPLACER® pico rs

High Density Rework Station

FINEPLACER® pico rs is an enhanced hot air rework station for assembly and rework of all types of SMD components.

The system is a best seller for professional mobile device rework in high density environments. A high level of process modularity allows all rework process steps within one system. The FINEPLACER® pico rs system is at home in R&D, process development, prototyping and production environments.

Application area from 01005 up to large BGA on small to medium sized PCBs, with the goal to have highly reproducible soldering results.

  • Rework station FINEPLACER® pico rs

Highlights*

  • Industry-leading thermal management
  • Components from 0.125 mm x 0.125 mm to 90 mm x 70 mm
  • Board sizes up to 400 mm x 234 mm
  • High efficiency board heater
  • Closed loop force control
  • Automated top heater calibration
  • Placement accuracy better than 5 µm

Features

  • Automated soldering processes
  • Overlay vision alignment system (VAS) with fixed beam splitter
  • Modular design
  • Integrated Process Management (IPM)
  • Real time process observation camera
  • Adaptive process library
  • Process transfer from system to system

Benefits

  • Hands-off component placement, user independent process operation
  • Outstanding placement accuracy and instant operation without adjustments
  • Provides high level of application flexibility
  • Synchronized control of all process related parameters: force, temperature, time, flow, power, process environment and illumination
  • Immediate visual feedback reduces process development time
  • Fast and easy process development
  • Identical results on different machines allow central profile development,administration and distribution

Processes

Applications

  • Soldering of:
    • BGA, µBGA/CSP, QFN, DFN, PoP, QFP, PGA, SON
    • Small passives down to 01005
    • RF shields, RF frames
    • Connectors, sockets
    • Sub assemblies, daughter boards
    • Flip Chip (C4)
  • Pin in Paste (PiP)
  • Trough Hole Reflow (THR)
  • Reworkable underfill, conformal coating
  • Single ball rework

Technical Specifications

Placement accuracy:5 µm
Field of view (min)1:11.5 mm x 8.6 mm
Field of view (max)1:69 mm x 53 mm
Component size (min)1:0.125 mm x 0.125 mm
Component size (max)1:50 mm x 50 mm
Thermocouples2*:2-8
Top Heating²:
  Power:900 W
  Temperature ramp rate:1 K/s - 50 K/s
  Flow range:10 Nl/min - 70 Nl/min
Bottom Heating²:
  Power:1600 W 
  Heated area (max):280 mm x 250 mm
  Flow range:32 Nl/min - 160 Nl/min

* depending on configuration/application
1 standard value, other values on request
2 optional modules

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