Bottom Heating Module
The heat source of the Bottom Heating Module provides heat transfer via inert gas or air. The wide variety of heaters ensures an appropriate solution for various applications. Finetech's approach replaces excessive electrical power application by efficient use of energy.
Bottom Heating Modules are part of the Integrated Process Management system (IPM) which offers software-controlled interaction of top and bottom heating. IPM provides one profile for the entire thermal management of every rework step. The result is minimized thermal load to board and component and a maximum of process reproducibility.
All bottom heaters can be adapted to different board sizes.
Highlights*
- Even heat distribution
- Precise board temperature control
- Reproducible soldering profiles
- Specific heating and cooling profiles
- Supports dynamic ramp rates
- Controlled active cooling function meets JEDEC/IPC standards
- Preheating capabilities
- Lead-free approved
- Adaptable for various PCB sizes
* depending on system and configuration
Available for FINEPLACER® micro hvr
Bottom Heating Module RB11
| Power (max): | 1600 W |
| Gas temperature (max): | 360 °C |
| Flow range: | 32 Nl/min - 160 Nl/min |
| Flow resolution: | 16 Nl/min |
| Ramp rate: | 1 K/s - 10 K/s |
| Ramp resolution: | 1 K/s |
| Heated area (max): | 280 x 250 mm² |
| Heated area (min): | 280 x 100 mm² |
| Number of heating zones: | 1 |
| Sales code: | RB11 |
Bottom Heating Module RB18
| Power (max): | 1400 W |
| Gas temperature (max): | 320 °C |
| Flow: | 4 x 12 Nl/min |
| Flow deviation: | ±1 Nl/min |
| Ramp rate: | 0.1 K/s - 10 K/s |
| Ramp resolution: | 0.1 K/s |
| Heated area (max): | 330 x 170 mm² |
| Heated area (min): | 170 x 82.5 mm² |
| Number of heating zones: | 4 |
| Sales code: | RB18 |
*Technical data are standard values (other values on request). Specifications given are subject to change without notice and may not be used as a basis for a binding offer or quotation.