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  • Robert Avila
    Finetech - USA/West
    Phone:
    +1 480 893 1630
    Fax:
    +1 480 893 1632
    Micro AssemblyPartner ReworkPartner
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FINEPLACER® matrix rs

Future in Advanced Rework

The FINEPLACER® matrix rs is a semi-automatic rework station representing the latest development from Finetech, encompassing the “Built to be Best” philosophy.

With a high level of process modularity, the system supports the complete rework cycle in a platform ergonomically designed to provide a state-of-the-art technical solution, low maintenance and easy service access.

Open application architecture ensures compatibility with future technologies as users transition from R&D into OEM production.

  • Rework station FINEPLACER® matrix rs

Highlights

  • Industry-leading thermal management
  • Components from 0.125 mm x 0.125 mm to 100 mm x 100 mm*
  • Board sizes up to 460 mm x 390 mm*
  • Automated top heater calibration
  • Closed loop force control
  • Real time contrast optimization with LED lighting
  • Fast conversion from rework station to die bonder
  • Ergonomic and intuitive design reduces user fatigue
  • Placement accuracy better than 10 µm

* depending on configuration

Features

  • Automated processes
  • Vision alignment system with fixed beam splitter
  • Integrated Process Management (IPM)
  • Real time process observation camera
  • Adaptive process library
  • Process transfer from system to system

Benefits

  • Hands-off component placement, user independent process operation
  • Outstanding placement accuracy and instant operation without adjustments
  • Synchronized control of all process related parameters: force, temperature, time, flow, power, process environment and illumination
  • Immediate visual feedback reduces process development time
  • Fast and easy process development
  • Identical results on different machines allow central profile development, administration and distribution

Processes

Applications

  • Soldering of:
    • BGA, µBGA/CSP, QFN, DFN, PoP, QFP, PGA, SON
    • Small passives down to 01005
    • RF shields, RF frames
    • Connectors, sockets
    • Sub assemblies, daughter boards
    • Flipchip (C4)
  • Pin in Paste (PiP)
  • Through Hole Reflow (THR)
  • Reworkable underfill, conformal coating
  • Single ball rework
  • Micro assembly applications

Technical Specifications

Placement accuracy:10 µm
Field of view (min)1:3.5 mm x 2.6 mm
Field of view (max)1:43 mm x 32 mm
Component size (min)1:0.125 mm x 0.125 mm
Component size (max)1:100 mm x 100 mm
Theta fine travel:± 2°
Thermocouples*:8
Top Heating²:
  Power: 900 W
  Temperature ramp rate: 1 K/s - 50 K/s
  Flow range: 10 Nl/min - 70 Nl/min
Bottom Heating²:
  Power: 4200 W (12 zones)
  Heated area (max): 450 mm x 300 mm
  Flow range: 192 Nl/min

* depending on configuration/application
1 standard value, other values on request
2 optional modules