Energy-efficient, Cost-effective Rework Station

The FINEPLACER® core is a versatile rework system offering energy-efficient hot gas rework technology for a wide spectrum of SMD components from smallest components to large BGA.

The easy-to-handle machine integrates the complete SMD rework cycle into an compact design, without diminishing functionality. Quite on the contrary, professional features such as digital calibration, Process Start Sensor, Process Gas Switching, 01005 Rework Package, PCB recognition by Bar Code Scanning and a touch screen user interface are available, making the system a future-proof investment.

FINEPLACER® core comes with a high efficiency bottom heating developed for rework of small sized PCBs, e.g. for mobile devices.

With enhanced functionalites, the system is the "Swiss Army Knife" of professional SMD rework.

  • FINEPLACER® core rework station
  • Flash is required!
    BGA Reballing
  • Flash is required!
    BGA / CSP Repair
  • Flash is required!
    Mobile phone rework


  • Component sizes from 0.125 mm x 0.125 mm 
    up to 90 mm x 90 mm
  • Eco-friendly thermal management solution with high-efficiency hot gas top and bottom heating
  • Digital top heater calibration
  • Automatic pick-up / touch-down with force measurement
  • Automated processes
  • Gesture-based operating interface
  • Compact, integrated machine design
  • Cost efficient soldering tools, compatible with all FINEPLACER® rework stations

* depending on configuration


  • Hot gas rework station
  • Automated soldering processes
  • Compact and robust design
  • Vision alignment system with fixed beam splitter
  • Intelligent thermal management
  • Real time process observation camera
  • Digital top heating calibration
  • Manual precision Z-travel range of the reflow arm


  • Even and reproducible heat distribution
  • User independent process operation
  • The whole rework cycle within one cost-effective system solution
  • Reproducible placement accuracy
  • Coordinated control of all process parameters: temperature, flow, time, process environment
  • Immediate visual feedback reduces process development time
  • Quick machine setup time
  • Safe handling of sensitive components



Technical Specifications

Placement accuracy:25 µm
Field of view (min)1:12 mm x 7.5 mm
Field of view (max)1:66 mm x 45 mm
Component size (min)1:0.25 mm x 0.25 mm
Component size (max)1:60 mm x 60 mm
Board size (max):350 mm x 310 mm
Board thickness (max):6 mm
Top Heating:
  Power:900 W
  Temperature ramp rate:1 K/s - 50 K/s
  Flow range:10 Nl/min - 70 Nl/min
Board Heating:
  Power:900 W
  Heated area (max)²:100 mm x 100 mm
  Flow range:10 Nl/min - 70 Nl/min

* depending on configuration/application
1 standard value, other values on request
2 optional modules