Residual Solder Removal
An accurate residual solder removal is an essential factor of success for most rework applications. However, increasing packing density and ever shrinking sizes of SMD components make it more and more difficult to get sufficient access to the component site.
Finetech is offering removal solutions for virtually all SMD component sizes in the market.
The Finetech Solution
Contactless Solder Removal on BGA and PCB
Manual residual solder removal is not a reproducible process and holds the risk of damaging nearby components as well as solder resist or PCB tracks which could result in a defective board or BGA. Therefore, Finetech offers solutions for contactless solder removal in a single sweep which allow a safe, careful and - most important- reproducible dressing even of very small sites on heavily populated boards.
After starting a reflow process, molten solder is easily removed from the board with powerful vacuum. The new generation of solder removal tools allow contactless residual solder removal without disturbing any pads or solder resist. Adjacent components and the PCB will be protected reliably from damage.
Contactless Solder Removal for Large Components
The "Twin Power" Solder Removal Head with dual chamber system for an increased flow rate is the best contactless solder removal choice for large SMD components of 50 mm edge length. Solutions for even bigger component dimensions are available on request.
By providing constant suction power over the whole width of the site and combined with precise heat management, the "Twin Power" Solder Removal Head can quickly and reliably remove liquid solder in a single sweep. Stress to the component will be reduced to an absolute minimum.
Integrated Process Management (IPM)
The Integrated Process Management (IPM) is the center piece of a FINEPLACER® system1 - the place where it all comes together. IPM is more than just thermal management. It synchronizes the control of all process modules and their related parameters:
- Controlled and precisely balanced interaction of top and bottom (pre-)heating and cooling
- Control of temperature, time, force, power, energy, flow
- Controlled process gas integration for reduced solder contamination, minimized surface tension effects and smooth spherical solder residues
IPM is very complex, yet easy to access. Via the GUI of the operating software, the user has perfect control of all required adjustments. Just drag 'n drop to define temperature ramps or activate process modules. All settings are represented in only one profile, making for a very intuitive work flow.
The operating software provides an ever-growing library of profiles for all kinds of processes. It also offers comprehensive data logging functions essential for statistical process control.
In combination with the system-to-system process transfer capability this is as easy as process development can get.
1 FINEPLACER® core offers co-ordinated top and bottom heating but does not support IPM
Recommended Rework Systems
Amongst other factors, the recommended system mainly depends on size and pitch of your component and the required process flexiblity.
Browse our product range or get in contact with your sales contact to figure out the best equipment solution for your needs.