BGA Reballing

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The accurate placement of a new array of solder spheres is called array reballing. It is advisable if valuable resources (and money) need to be saved or to to extend the value chain.

Array reballing is typically necessary if the assembly line has misplaced the BGA grid array, if the solder paste printer has failed or if PCB pads have oxidized and the solder balls do not connect properly.

  • Refurbished BGA
    Refurbished BGA
  • BGA Reballing result (top view camera)
    BGA Reballing result (top view camera)
  • BGA Reballing result (process camera)
    BGA Reballing result (process camera)

BGA Reballing - the challenges

  • Remove defective BGA
  • Prevent surface contamination during removal
  • Apply flux on BGA
  • Simultaneous placement and reflow of a predefined ball array

The Finetech Solution

Contactless Solder Removal on BGA and PCB

  • Principle of a contactless solder removal nozzle

Manual residual solder removal is not a reproducible process and holds the risk of damaging nearby components as well as solder resist or PCB tracks which could result in a defective board or BGA. Therefore, Finetech offers solutions for contactless solder removal in a single sweep which allow a safe, careful and - most important- reproducible dressing even of very small sites on heavily populated boards.

After starting a reflow process, molten solder is easily removed from the board with powerful vacuum. The new generation of solder removal tools allow contactless residual solder removal without disturbing any pads or solder resist. Adjacent components and the PCB will be protected reliably from damage.

BGA Reballing Module

  • Reballing Module: frame holder with vacuum support; component support plate; reballing template
    Reballing Module with: frame holder with vacuum support; component support plate; reballing template

The "BGA Reballing Module" is a convenient, fast and easy-to-use solution to reball array components.

A brief description of the BGA reballing process:

  1. Put the BGA onto the support plate and activate vacuum of the frame holder to fix the component in place
  2. Align the component to the contactless solder removal nozzle
  3. Apply flux to the BGA pads
  4. Contactless solder and flux removal
  5. Clamp the reballing template onto the frame holder and align the template holes to the BGA pads, using the FINEPLACER® Vision Alignment System
  6. Put fresh solder balls onto the reballing template with an ESD brush until every hole is filled with a solder ball
  7. Clamp the BGA frame holder into the positioning table, align to the soldering nozzle and start the software-controlled reballing process
  8. After cooling, remove the reballing template and check all connections using the "Process Video Module"

Each FINEPLACER® rework system can be easily retrofitted with a BGA Reballing Module.

MINIOVEN 04 - BGA Reballing - Stand-alone System

  • BGA Reballing System
    MINIOVEN 04 - BGA Reballing System

The MINIOVEN 04 is a compact and flexible IR reballing solution suitable for a wide range of SMD components. It provides smart functions such as integrated air circulation, nitrogen support and the easy-to-use interface. The optimized heat distribution allows even heating of the whole component. Combined with nitrogen unwanted oxidation process will be significantly reduced. The benefits are obvious: excellent wetting behavior of lead-free solders, increased surface tension and drastically improved long-time stability.

The MINIOVEN 04 integrates the entire temperature cycle for a defined reflow of grid arrays (e.g. BGA/CSP) and QFN/MLF components. 

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Integrated Process Management (IPM)

  • Integrated Process Management (IPM)
  • Principle of process gas integration
  • Operating software for rework

The Integrated Process Management (IPM) is the center piece of a FINEPLACER® system1 - the place where it all comes together. IPM is more than just thermal management. It synchronizes the control of all process modules and their related parameters:

  • Controlled and precisely balanced interaction of top and bottom (pre-)heating and cooling
  • Control of temperature, time, force, power, energy, flow
  • Process-integrated camera and light control
  • Controlled process gas integration for reduced solder contamination, minimized surface tension effects and smooth spherical solder residues

 IPM is very complex, yet easy to access. Via the GUI of the operating software, the user has perfect control of all required adjustments. Just drag 'n drop to define temperature ramps or activate process modules. All settings are represented in only one profile, making for a very intuitive work flow.
The operating software provides an ever-growing library of profiles for all kinds of processes. It also offers comprehensive data logging functions essential for statistical process control.

In combination with the system-to-system process transfer capability this is as easy as process development can get.

1 FINEPLACER® core offers co-ordinated top and bottom heating but does not support IPM

FINEPLACER® Rework Systems

  • FINEPLACER® coreplus
    Rework of medium-sized boards
  • FINEPLACER® pico rs
    High density rework station
  • FINEPLACER® micro rs
    Hot air SMD rework station

Amongst other factors, the recommended system mainly depends on size and pitch of your component and the required process flexiblity.

Browse our product range or get in contact with your sales contact to figure out the best equipment solution for your needs.